08/05/24
Discover the Future of Technical Cleanliness Assessments - Teknek at Electronics in Harsh Environments Conference
Join Us at SMTA's Electronics in Harsh Environments Conference
Reliability is paramount in industries like automotive, aerospace, and space. Yet, even with rigorous inspection processes, latent defects can slip through, especially in harsh environments. Particulate contamination poses a significant threat, necessitating efforts to eliminate it at every assembly stage.
At our conference session, delve into the groundbreaking approach of Improving Reliability with Technical Cleanliness Assessments Using Contact Cleaning. We'll explore the limitations of current sampling techniques, like VDA 19 Part 1, and unveil how Contact Cleaning installed before solder paste print can revolutionize the process.