Contamination control at the start of the line
Teknek will be showcasing its cutting-edge Tek-BC board cleaner at the Future Packaging Line curated by Fraunhofer IZM.
This close-up demo line replicates the whole assembly process. Taking place at the upcoming SMTconnect exhibition in Nuremberg from 11th to 13th of June.
It’s a prime opportunity to see our IP-protected board cleaner live in action, with three daily guided tours at 10am, 1pm, and 3pm.
For additional insights on "why clean boards" join our forum presentation at 1:30pm on Wednesday 12th of June, Hall 4 Stand 115.
Teknek has been a pioneer in contamination control within the SMT sector, enhancing manufacturing processes and ensuring product reliability.
Tek-BC Low static, low strain in-line board cleaner
Our innovative, low static, precision touch technology removes contamination at critical junctures in the SMT process.
Independently certified to ANSI/ESD s20.20 our contamination control is trusted by globally leading Tier 1 producers
By incorporating our board cleaners into your manufacturing line, you can:
1. Enhance Component Placement Accuracy: Improve the precision of component placements, reducing errors and rework.
2. Minimize Soldering Defects: Achieve higher quality solder joints by eliminating contamination at critical stages.
3. Improve Overall Product Reliability: Ensure consistent performance and longevity of your products.
